| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for assembling electronic devices which includes at least one coating element for applying a moisture-resistant coating to surfaces of an electronic device under assembly or an electronic subassembly.SOLUTION: When components and one or more moisture-resistant coatings are added to an electronic subassembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed. |
