METHOD OF MANUFACTURING LED DEVICE USING SI SUBSTRATE

摘要

PURPOSE: A method for manufacturing a light emitting diode (LED) element using a silicon (Si) substrate is provided to use the Si substrate as a lead frame or a package, thereby remarkably reducing the size of the LED element. CONSTITUTION: A method for manufacturing a light emitting diode (LED) element using a silicon (Si) substrate includes: a step of forming the substrate with a silicon wafer; a step of forming multiple through-holes penetrating the substrate; a step of forming a hole insulating film (32) on the inner side of the through-hole; a step of forming a hole electrode (42) on the surface of the hole insulating film; and a step of forming an upper side insulating film (31) on the upper side of the substrate.