VACUUM PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus capable of suppressing a decrease in throughput of processing.SOLUTION: A vacuum processing apparatus includes: a plurality of vacuum transfer chambers which are disposed behind an atmosphere transfer chamber and to which a wafer to be processed is transferred, and to each of which a vacuum processing chamber for processing the wafer to be processed using plasma is connected; an intermediate chamber in which the wafer to be processed is mounted and accommodated while transferred between those vacuum transfer chambers; and a lock chamber which is arranged between the vacuum transfer chambers and a back of the atmosphere transfer chamber. The vacuum processing apparatus transfers the wafer to be processed accommodated in a cassette mounted on a cassette table to one of the plurality of vacuum processing chambers through the lock chamber and processes the wafer. An accommodation section for a dummy wafer arranged in each processing chamber when processing the dummy wafer in each processing chamber under each different condition from the processing by generating plasma in each processing chamber is arranged in the intermediate chamber.