DEVICE MANUFACTURING METHOD AND MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a device manufacturing method capable of forming a conductive film by embedding a conductive material in a fine recess provided on one surface of a substrate without any space.SOLUTION: A device manufacturing method is a deposition method comprising at least a first step of forming a barrier film 103 so as to cover at least an inner wall surface 102a of a recess provided on one surface 101a of a substrate 101 with respect to the substrate 101, a second step of forming a conductive film 104 so as to cover the barrier film 103, and a third step of melting the conductive film 104 by a reflow method. This manufacturing method also includes a step α of exposing a substrate in which the barrier film 103 and the conductive film 104 were laminated in this order through the second step in a pressure A atmosphere only for a time B between the second step and the third step. The method controls the step α so that a product of the pressure A and the time B becomes less than or equal to 6×10[Pa s] in the step.