| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device such that a semiconductor chip can be cooled from both surfaces.SOLUTION: A semiconductor package includes: a semiconductor chip; a main electrode provided with a heat sink on a side opposed to the semiconductor chip; a lead frame provided to the semiconductor chip; and an insulating sealing material which accommodates the semiconductor chip, the main electrode, and a part of the lead frame. A semiconductor device includes a cooling device having a semiconductor package installation part provided with the semiconductor package and a semiconductor package provided to the semiconductor package installation part and described in one of claims 1-4. |
