| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent excitations between a protection layer and a test pattern in a sawing process and a packaging process by including a first fixing pin which passes through a slit of the test pattern. CONSTITUTION: A test pattern (130) is formed on a wafer of a scribe lane. The test pattern includes one or more slits (130A). The protection layer covers the test pattern. A plurality of fixing pins (140) are extended from the protection layer and are embedded in the wafer. A first fixing pin (140A) passes through the slit. A second fixing pin (140B) is formed outside the test pattern. [Reference numerals] (AA) Sawing line
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