发明名称 ELECTRONIC CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit board in which a conductive wire is not peeled off by temperature cycles in a use environment, and to provide a semiconductor device using the electronic circuit board.SOLUTION: An electronic circuit board comprises: a metal plate 1; an insulating layer 2 directly formed to the metal plate without an adhesive layer; and a conductive wire 3 formed to the insulating layer. The insulating layer has an inorganic insulation part 21 made of an inorganic material, and an inorganic/organic mixture insulation part 22 containing an organic material in cavities of the inorganic material. The inorganic/organic mixture insulation part is formed to at least a part of an interface between the insulating layer and the conductive wire.
申请公布号 JP2013143414(A) 申请公布日期 2013.07.22
申请号 JP20120001778 申请日期 2012.01.10
申请人 HITACHI LTD 发明人 NAOE KAZUAKI
分类号 H01L23/12;H01L23/36;H05K1/03;H05K1/05;H05K3/28 主分类号 H01L23/12
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