| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus capable of preventing a contaminant sticking on a wafer to be processed from sticking on a wafer having been processed.SOLUTION: A wafer transfer apparatus includes: a carrying-in load port 2A mounted with a FOUP 1 accommodating a wafer W1 to be processed; a carrying-in chamber 3A provided with a transfer robot 4A which takes the wafer W1 to be processed out of the FOUP 1; a carrying-in load lock 5A that the transfer robot 4A can access from the side of the carrying-in chamber 3A; a carrying-out load port 2B capable of being loaded with the FOUP 1 capable of accommodating a wafer W2 having been processed; a carrying-out chamber 3B provided with a transfer robot 4B which delivers the wafer W2 having been processed to the FOUP 1; and a carrying-out load lock 5B that the transfer robot 4B can access from the side of the carrying-out chamber 3B. The carrying-in chamber 3A and the carrying-out chamber 3B are apart from each other and the carrying-in load lock 5A and the carrying-out load rock 5B are arranged on different levels. |
