POWER SEMICONDUCTOR MODULE, POWER MODULE AND POWER MODULE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve heat conductivity and radiation performance of an insulation layer formed of a conductor plate shape.SOLUTION: A power semiconductor module comprises a conductor plate 315 and a module case 304 which are joined by an insulation layer 700. The insulation layer 700 includes a sprayed film 710 and an insulation film 720 provided on the sprayed film 710. The insulation film 720 includes a resin 721 containing a filler 722 such as ceramic and a part of the filler-containing resin is impregnated in a cavity 712 of a thermal spray material 711 which composes the sprayed film 710.