METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component package in which productivity is excellent and which secures conductivity between an electronic component and an external electrode, and also to provide the electronic component package.SOLUTION: An electronic component package includes: a base material 11 obtained by polishing a base material 10; a conductive member 31 which penetrates through the base material 11 and is fused with a low melting glass 21 after an insulating substance on the surface is removed by polishing ; an electronic component 60 installed on one face of the conductive member 31 via internal wiring 40 and a connection 50; an external electrode 90 installed on the face of the base material 11 opposite to the face on which the electronic component 60 is installed, via an insulation resin 25 and a metal film 80; and a cover 70 which protects the electronic component 60 on the base material 11.