SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component element which achieves low costs and improves heat radiation performance and insulation reliability while dealing with the electronic component element including narrow pitch bumps.SOLUTION: A substrate for mounting an LED element 16 has a substrate 1 and a conductor circuit including flip chip terminals 13 provided on the substrate 1. Side surfaces 13a of the flip chip terminals 13 are covered by insulation resins 5 formed in gaps between the flip chip terminals 13. Further, noble metal plating 7 is formed on upper surfaces of the flip chip terminals 13.