发明名称 |
LED 3D CURVED LEAD FRAME OF ILLUMINATION DEVICE |
摘要 |
PURPOSE: A light emitting diode (LED) 3D curved lead frame of a lighting device is provided to increase heat dissipation capacity, by using ductility and plastic deformation property of a conductive metal. CONSTITUTION: A spiral joint (17) is located in the upper part. A lighting curved surface (11) is located in the lower part. The lighting curved part is connected to a heat radiation fin (12). An LED 3D curved lead frame is installed on the lighting curved surface. A main body has the heat radiation fin extended outward. |
申请公布号 |
KR20130083409(A) |
申请公布日期 |
2013.07.22 |
申请号 |
KR20130003534 |
申请日期 |
2013.01.11 |
申请人 |
LONGWIDE TECHNOLOGY INC. |
发明人 |
CHIEN HUAN JAN;TSAI TSUNG HONG |
分类号 |
F21V17/00;F21S2/00;F21V23/00 |
主分类号 |
F21V17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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