METHOD OF FABRICATING PACKAGE ON PACKAGE DEVICE AND THE DEVICE

摘要

PURPOSE: A method for manufacturing a package-on-package and a device manufactured by the same are provided to prevent the warpage of a semiconductor package and to reduce the thickness of the semiconductor package by a grinding process after a molding layer is formed. CONSTITUTION: A bottom semiconductor package is manufactured (S10). A bottom semiconductor chip is mounted on the bottom semiconductor package (S11). A bottom molding layer is formed to cover the bottom package substrate and the side of the bottom semiconductor chip (S12). The upper sides of the bottom molding layer and the bottom semiconductor chip are removed by a grinding process (S13). A top semiconductor package is mounted on the bottom semiconductor package (S20). [Reference numerals] (S10) Bottom semiconductor package is manufactured; (S11) Bottom semiconductor chip is mounted on a bottom package substrate with a flip chip bonding method; (S12) Bottom molding layer is formed to cover the bottom package substrate and the side of the bottom semiconductor chip; (S13) Upper sides of a bottom molding layer and a bottom semiconductor chip are removed by a grinding process; (S20) Top semiconductor package is mounted on a bottom semiconductor package