| 摘要 |
PURPOSE: A substrate processing apparatus is provided to improve the RF power efficiency by positioning the antenna in a groove after forming the groove on the insulation plate. CONSTITUTION: A processing chamber offers the reaction space by the bond of the lead including a body and a plurality of openings. A plurality of insulating plates seals hermetically the plurality of openings and has a plurality of grooves. It is separated in a plurality of groove each insides and a plurality of antennae(118) locates. A gas injection unit(124) is installed on the lead or the plurality of insulating plates. A substrate snuggly unit(122) is positioned on the reaction space and accepts the substrate. |
