| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition excellent in heat resistance and etching resistance.SOLUTION: There is disclosed a thermosetting resin composition composed of a phenol resin having phenol components consisting of fluorenes having a phenolic hydroxy group and phenols, and having ≥2,000 weight-average molecular weight and an epoxy compound having a fluorene backbone. The phenol resin may be a condensate obtained by condensing the methylol form of the fluorenes having the phenolic hydroxy group with the phenols in the presence of an acid catalyst. In the epoxy compound having the fluorene backbone, 9,9-bis(glycidyloxyphenyl)fluorene, 9,9-bis(mono- or di-Calkylglycidyloxyphenyl)fluorene, 9,9-bis(glycidyloxynaphthyl)fluorene, and their adducts with a Calkyleneoxide, etc., are included. |
