发明名称 LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE
摘要 A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate.
申请公布号 US2013180765(A1) 申请公布日期 2013.07.18
申请号 US201213624152 申请日期 2012.09.21
申请人 HITACHI CHEMICAL COMPANY, LTD.;HITACHI CHEMICAL COMPANY, LTD. 发明人 AOSHIMA MASAHIRO;TAKAHASHI YOSHIHIRO;YAMAZAKI YUKA;KAMIGATA YASUO;MURAI HIKARI
分类号 B32B17/10;B32B7/02;H05K1/03 主分类号 B32B17/10
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