| 发明名称 |
WAFER FILL PATTERNS AND USES |
| 摘要 |
A semiconductor device includes an active region including an element formed in a double etch, double exposure method and an inactive region including one or more fills, at least one of the one or more fills including a cut-away hole formed therein, where the cut-away holes expose a layer in the inactive region used for an endpoint detection.
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| 申请公布号 |
US2013181267(A1) |
申请公布日期 |
2013.07.18 |
| 申请号 |
US201313788776 |
申请日期 |
2013.03.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BURKHARDT MARTIN;COLBURN MATTHEW E.;GABOR ALLEN H.;GLUSHCENKOV OLEG;HALLE SCOTT D.;LANDIS HOWARD S.;WANG HELEN |
| 分类号 |
H01L29/78 |
主分类号 |
H01L29/78 |
| 代理机构 |
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代理人 |
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| 主权项 |
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