Method for manufacturing composite component carrier for supporting e.g. organic LED on circuit board, involves isolating carrier elements of leadframe from each other and embedding isolated carrier elements in mold material

摘要

The method involves providing a leadframe (10) i.e. quad-flat no-lead leadframe, which comprises multiple carrier elements (12) that are connected with each other by connectors (14). The leadframe is arranged between shaped bodies (22, 24) of a molding tool (20), which is formed for embedding the leadframe in a mold material e.g. epoxy. The connectors of the embedded leadframe are cut by the shaped bodies when the connectors are pressed into the leadframe and the carrier elements are isolated from each other. The isolated carrier elements are embedded in the mold material. Independent claims are also included for the following: (1) a device for manufacturing a composite component carrier (2) a composite component carrier.