| 摘要 |
PROBLEM TO BE SOLVED: To enable manufacturing a semiconductor device with high accuracy; and especially, enable manufacturing of a solid-state image pick-up device having high picture quality.SOLUTION: A semiconductor device manufacturing method comprises: forming a first waveguide member 118 on a semiconductor substrate 101 in an imaging region 103 and a peripheral region 104; removing a part of the first waveguide member 118 arranged on the peripheral region 104; and subsequently, performing a planarization process of planarizing a surface of the first waveguide member 118 on a side opposite to a side of the semiconductor substrate 101. |
