| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an electronic device, a sensor or wiring capable of avoiding a damage caused by the contact with a foreign matter by dramatically enhancing the adhesion strength of particles to a substrate.SOLUTION: A substrate 4 is converted into a deformable state by raising the temperature of the substrate 4 to the melting point or softening temperature of a thermoplastic resin constituting the substrate 4 by using a heat source 1. Then, a conductive particle group is allowed to collide to the substrate 4 in the deformable state by a particle injection means 2 while adjusting the injection speed of the particle group to be buried into the substrate 4 up to a depth corresponding to the injection speed in the form of line or flat surface. Thereby, there are formed the electronic device, sensor or wiring which are composed of the particle group and buried in the substrate 4 up to the depth from the surface thereof. |
