| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power conversion device that implements improved cooling efficiency of semiconductor power conversion elements or semiconductor power conversion modules connected in parallel in the semiconductor power conversion device.SOLUTION: In the semiconductor power conversion device configured so that a plurality of semiconductor power conversion elements or semiconductor power conversion modules connected in parallel are arrayed in the same direction as a flow of cooling medium supplied thereto, AC output ends of the plurality of semiconductor power conversion elements or semiconductor power conversion modules are connected in parallel with each other via a connecting conductor, a common lead conductor is led out from the connecting conductor, and the common lead conductor is formed such that the semiconductor power conversion element or semiconductor power conversion module arranged on a downstream side with the flow of cooling medium has a higher wiring impedance than the semiconductor power conversion element or semiconductor power conversion module arranged on an upstream side with the flow of cooling medium. |
