SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING A HEAT SPREADER AND SEMICONDUCTOR PACKAGE MOUNT STRUCTURE HAVING THE SAME

摘要

PURPOSE: A laminating structure of a semiconductor package and a mounting structure of a semiconductor package are provided to efficiently discharge heat generated inside to outside by containing a metal. CONSTITUTION: A lower part semiconductor package (120) contains a lower part package substrate (121) and a lower part semiconductor chip (123). The semidonductor package (110) contains an upper package substrate (111) and an upper semiconductor chip (113). The semiconductor chip is arranged on the upper package substrate. A heat transfer unit (140A) is arranged between the lower semiconductor package and an upper semiconductor package. The heat transfer unit contains the metal.