| 摘要 |
Disclosed is a heat sink, capable of being simply connected with circuit elements and being adjusted in both size and thickness according to the number and volume of the circuit elements. The heat sink comprises a support plate, multiple heat radiating pins vertically protruding from one surface of the support plate, an element inserting groove which is formed by sinking from another surface of the support plate along the longitudinal direction, and an element support portion formed by protruding from the element inserting groove and used for supporting the circuit elements. According to the utility model, the circuit elements slide and are connected to the heat sink, thereby cutting out the drilling process of connecting the circuit elements to the heat sink and accordingly deceasing the cost and raising the productivity. As the circuit elements can move freely, the installing position can be simply corrected. |
