发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 According to an embodiment, a method of manufacturing a semiconductor device is provided. The method of manufacturing a semiconductor device includes forming a blocking film by a material including at least carbon on an upper surface of a second element among a first element and the second element formed on a semiconductor substrate, the blocking film configured to inhibit the second element from turning into salicide.
申请公布号 US2013181307(A1) 申请公布日期 2013.07.18
申请号 US201213472796 申请日期 2012.05.16
申请人 OHTA ATSUSHI;KABUSHIKI KAISHA TOSHIBA 发明人 OHTA ATSUSHI
分类号 H01L27/14;H01L31/18 主分类号 H01L27/14
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