发明名称 LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE
摘要 A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
申请公布号 US2013180760(A1) 申请公布日期 2013.07.18
申请号 US201213624088 申请日期 2012.09.21
申请人 HITACHI CHEMICAL COMPANY, LTD.;HITACHI CHEMICAL COMPANY, LTD. 发明人 AOSHIMA MASAHIRO;TAKAHASHI YOSHIHIRO;YAMAZAKI YUKA;KAMIGATA YASUO;MURAI HIKARI
分类号 H05K1/03;H05K1/02 主分类号 H05K1/03
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