发明名称 |
LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE |
摘要 |
A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.
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申请公布号 |
US2013180760(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201213624088 |
申请日期 |
2012.09.21 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
AOSHIMA MASAHIRO;TAKAHASHI YOSHIHIRO;YAMAZAKI YUKA;KAMIGATA YASUO;MURAI HIKARI |
分类号 |
H05K1/03;H05K1/02 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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