发明名称 IC DIE, SEMICONDUCTOR PACKAGE, PRINTED CIRCUIT BOARD AND IC DIE MANUFACTURING METHOD
摘要 In an example embodiment, an integrated circuit (IC) comprises a substrate separating one of a source and drain from a semiconductor region. The IC comprises a vertical transistor including the source or drain. A gate electrode is formed in a trench extending into the semiconductor region; the gate electrode is electrically insulated from the semiconductor region by a dielectric lining in the trench and the other of said source or drain in the semiconducting region. An insulating trench terminates the vertical transistor; a vertical capacitor region (V-Cap) is adjacent to the vertical transistor; a first capacitor plate of the V-Cap comprises the source or drain separated from the semiconductor region by the substrate; the V-Cap further comprises at least one trench extending into the semiconductor region; the at least one trench comprises an electrically insulating liner material insulating a conductive material defining a second capacitor plate separated from the first capacitor plate.
申请公布号 US2013181272(A1) 申请公布日期 2013.07.18
申请号 US201213549684 申请日期 2012.07.16
申请人 RUTTER PHIL;NXP B.V. 发明人 RUTTER PHIL
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项
地址