发明名称 |
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Embodiments provide a wiring board which is structured to be suitable for connection with components, whereby its reliability can be improved. An embodied wiring board of the invention has pads and a solder resist in which opening portions which expose the pads are formed. Protrusion-shaped members are fixed to some of the surfaces of the pads. The surfaces of the pads and the surfaces of the protrusion-shaped members are covered with solder bumps. The height of the solder bumps is larger than the height H1 and H2 of the protrusion-shaped members. The opening portions have different inner diameters, and the volume of the protrusion-shaped members increases as the diameter of the opening portion decreases. |
申请公布号 |
US2013180772(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201213719665 |
申请日期 |
2012.12.19 |
申请人 |
NGK SPARK PLUG CO., LTD.;NGK SPARK PLUG CO., LTD. |
发明人 |
INOUE MASAHIRO;SUGIMOTO ATSUHIKO |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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