| 摘要 |
<p>Provided is a power conversion apparatus, which can efficiently dissipate heat to a cooling body without having a housing in a path for dissipating heat of a heat generating circuit component mounted on a substrate. This power conversion apparatus is provided with: a semiconductor power module (11) having a cooling member (13) provided on one surface thereof, said cooling member being bonded to a cooling body; and a mounting substrate (22), which has a circuit component mounted on the other surface side of the semiconductor power module, said circuit component including a heat generating circuit component (39) that drives the semiconductor power module. The cooling member has substrate heat absorbing portions (13b, 13c), which extend to the vicinity of the mounting substrate.</p> |
