| 摘要 |
<p>In a substrate processing device, the pattern of a mask (M) is formed on the light sensitive layer of a bendable elongated substrate (S). The substrate processing device is provided with: a mask holding unit (52) which is cylindrically formed and holds a mask pattern along the cylindrical surface thereof, said mask holding unit being rotatable around a prescribed axial line (AX) along the cylindrical surface; a feed device (TF) which feeds the substrate while a given length of substrate is wound on the cylindrical surface of the mask holding unit; and an adjustment device which controls the driving of either the mask holding unit and/or the feed device, and adjusts the relative positions of the mask holding unit and the substrate when the substrate is wound on a specific region of the cylindrical surface of the mask holding unit in the circumferential direction.</p> |
