METHOD FOR DICING WAFER AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE CHIPS USING THE SAME

摘要

PURPOSE: A wafer dicing method and a light-emitting element chip production method using the same are provided to prevent contamination of a fluorescent substance layer by forming the fluorescent layer on a light-emitting element after dicing a wafer and the light-emitting element. CONSTITUTION: A semiconductor element (120) is formed on a first surface of a wafer (110). A part of the wafer and the semiconductor element are diced for the first time. The first diced area on the wafer is diced for the second time. The wafer and the semiconductor element are separated into multiple semiconductor element chips. A dicing tape (130) is attached on a second surface facing the first surface of the wafer.