发明名称 METHOD FOR MANUFACTURING SILICON SUBSTRATE HAVING TEXTURED STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a silicon substrate having a textured structure that, in comparison with previous methods, reduces manufacturing steps and allows a regular textured structure to be easily formed on a silicon substrate surface.SOLUTION: A manufacturing method of the present invention includes: (A) a step of forming a pattern on a silicon substrate using a composition containing a resin; (B) a step of irradiating etching gas on the surface of the silicon substrate other than the pattern portion; and (C) a step of processing the silicon substrate irradiated with the etching gas using an alkaline etching liquid to form a recessed structure under the pattern portion. Furthermore, the present invention provides a composition containing a resin used in the manufacturing method, in particular, a composition containing a photo-setting resin.
申请公布号 JP2013140954(A) 申请公布日期 2013.07.18
申请号 JP20120266499 申请日期 2012.12.05
申请人 TOKUYAMA CORP;HYOGO PREFECTURE 发明人 UMEKAWA HIDEKI;MATSUI SHINJI;OMOTO SHINYA
分类号 H01L21/306;C08G77/58;C08G79/00;H01L21/3065;H01L31/04 主分类号 H01L21/306
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