发明名称 PROCESSING DEVICE FOR PROCESSING RESIN MOLDING AND METHOD FOR MANUFACTURING PROCESSED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a technology which can increase the processing accuracy of a processing target of resin molding.SOLUTION: A processing device includes: a pressing part that is heated and presses the processing target region of the resin molding to melt the part; a drive unit for moving the pressing part toward the processing target region; and a control unit for controlling the processing device. The control unit calculates a melting starting point at which the processing target region starts to be melted based on a displacement rate of displacement caused in the pressing part, presses the pressing part ahead by a predetermined amount with respect to the processing target region based on a reference position where the pressing part is positioned at the time of melting starting point and then stops the movement of the pressing part moving toward the processing target region.
申请公布号 JP2013139111(A) 申请公布日期 2013.07.18
申请号 JP20120000344 申请日期 2012.01.05
申请人 SEIKO EPSON CORP 发明人 HARAYAMA SEIYA
分类号 B29C65/20 主分类号 B29C65/20
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