发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of uniformly performing substrate processing.SOLUTION: The substrate processing apparatus 100 includes: a treatment tank 110 at which a substrate 200 is positioned; a transfer part 120 passing through the treatment tank 110 and transferring the substrate 200 in a fixed direction; and a plurality of pipes 130 including a plurality of nozzles 150 for jetting a treatment solution to the substrate 200 in various directions.
申请公布号 JP2013139021(A) 申请公布日期 2013.07.18
申请号 JP20120200828 申请日期 2012.09.12
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM CHUL KYU;CHO WON WOO
分类号 B08B3/02 主分类号 B08B3/02
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