| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for static elimination by which quick static elimination of respective members of a substrate processing device can be performed by a simple method, and to provide a static elimination method using the same.SOLUTION: A wafer J for static elimination can be transported by a transportation mechanism of a substrate processing device 1, has a substrate shape capable of being mounted in each processing module, and includes: an ion generation electrode 51 that is configured by a discharge electrode 501, a dielectric electrode 502, and a dielectric body 503 sandwiched between the discharge electrode 501 and the dielectric electrode 502; and a high-voltage power supply circuit 53a and a battery 53b applying a voltage to the discharge electrode 501 and the dielectric electrode 502. Static elimination of the respective members of the substrate processing device 1 is performed by ions generated from the ion generating electrode 51. |
