| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element and a manufacturing method of the same, which is unlikely to cause peeling in a dicing process.SOLUTION: A semiconductor light-emitting element according to a present embodiment comprises: a support substrate; a junction layer provided on the support substrate; an LED layer provided on the junction layer; and a buffer layer softer than the junction layer. The buffer layer is arranged either between the support substrate and the junction layer or between the junction layer and the LED layer. |
