发明名称 |
MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, PIEZOELECTRIC OSCILLATOR, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To improve the wettability of a brazing material used for joining thereby improving airtightness and allow a worker to easily check joining defects from an appearance when a metal lid is joined to a ceramic substrate on which electronic components are mounted by radiating a laser beam.SOLUTION: An electronic device includes: an electronic component 20 joined onto one surface of an insulation substrate 10; and a metal lid 19 joined onto the metalization layer 13 through a brazing material 19B. The metalization layer includes a joint region 13A and a protruding region 13B. In a manufacturing method of the electronic device, at a process where the metal lid is joined onto the insulation substrate, a peripheral part of the metal lid is disposed on the joint region through the brazing material, and then a laser beam is radiated to the joint region and the protruding part. |
申请公布号 |
JP2013140876(A) |
申请公布日期 |
2013.07.18 |
申请号 |
JP20120000502 |
申请日期 |
2012.01.05 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MIYASAKA HIDEO |
分类号 |
H01L23/02;H03B5/32;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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