发明名称 MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, PIEZOELECTRIC OSCILLATOR, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the wettability of a brazing material used for joining thereby improving airtightness and allow a worker to easily check joining defects from an appearance when a metal lid is joined to a ceramic substrate on which electronic components are mounted by radiating a laser beam.SOLUTION: An electronic device includes: an electronic component 20 joined onto one surface of an insulation substrate 10; and a metal lid 19 joined onto the metalization layer 13 through a brazing material 19B. The metalization layer includes a joint region 13A and a protruding region 13B. In a manufacturing method of the electronic device, at a process where the metal lid is joined onto the insulation substrate, a peripheral part of the metal lid is disposed on the joint region through the brazing material, and then a laser beam is radiated to the joint region and the protruding part.
申请公布号 JP2013140876(A) 申请公布日期 2013.07.18
申请号 JP20120000502 申请日期 2012.01.05
申请人 SEIKO EPSON CORP 发明人 MIYASAKA HIDEO
分类号 H01L23/02;H03B5/32;H03H3/02;H03H9/02 主分类号 H01L23/02
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