| 发明名称 |
METHOD OF MANUFACTURING A PACKAGE SUBSTRATE |
| 摘要 |
A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.
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| 申请公布号 |
US2013180651(A1) |
申请公布日期 |
2013.07.18 |
| 申请号 |
US201213350008 |
申请日期 |
2012.01.13 |
| 申请人 |
YEN LEE-SHENG;WANG DOAU-TZU;ADVANCE MATERIALS CORPORATION |
发明人 |
YEN LEE-SHENG;WANG DOAU-TZU |
| 分类号 |
B32B37/02;B32B37/12;B32B38/10 |
主分类号 |
B32B37/02 |
| 代理机构 |
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代理人 |
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