METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE

摘要

PURPOSE: An apparatus and method for manufacturing a light emitting diode package are provided to form the correlated color temperature of light emitted from the light emitting diode package to be close to the desired correlated color temperature of the light. CONSTITUTION: A lead frame is continuously loaded on a transfer device (302). A photoluminescent mixture of a first concentration is distributed to cavities of the lead frame (304). Light emitted from a corresponding array of LED packages arranged on the lead frame is tested (306). A photoluminescent mixture of a second concentration is distributed to each cavity of the lead frame (310). The photoluminescent mixture is partially hardened (312). The photoluminescent mixture is completely hardened (316). [Reference numerals] (302) On-loading; (304) Distribute a photoluminescent mixture; (306) CCT test; (308) Is CCT within a target range ?; (310) Distribute a photoluminescent mixture; (312) Partial hardening; (314) Off-loading; (316) Complete hardening