| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting diode package having a large lighting angle.SOLUTION: A light emitting diode package 10 comprises: a substrate 11; electrodes 121, 122 installed on the substrate 11; a light emitting diode chip 13 electrically connected with the electrodes 121, 122; and a sealing body 14 covering the light emitting diode chip 13. An optical part 15 is installed in the sealing body 14 so as to be positioned immediately above the light emitting diode chip 13, and the optical part 15 includes a light incident surface contacting with the sealing body 14. Since the refraction index of the optical part 15 is smaller than the refraction rate of the sealing body 14, a part of light emitted form the light emitting diode chip 13 causes total reflection on the light incident surface 151 of the optical part 15 and is reflected by the light incident surface in a different direction offset from a center of the light emitting diode chip 13. |
