| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic flip chip mounting method which achieves small variations in a junction state of electrodes between a semiconductor chip and a substrate.SOLUTION: According to this invention, a method for mounting a semiconductor chip on a substrate includes: a first step where a semiconductor chip S, in which multiple bump electrodes 156 are formed on one major surface, and a substrate B, in which multiple electrode patterns 176 are formed on one major surface, are prepared and the bump electrodes 156 of the semiconductor chip S are placed in contact with the electrode patterns 176 of the substrate B; a second step where the bump electrodes 156 of the semiconductor chip S are separated from the electrode patterns 176 of the substrate B; and a third step where the bump electrodes 156 of the semiconductor chip S are placed in contact with the electrode patterns 176 of the substrate B and ultrasonic vibrations are provided to join the bump electrodes 156 to the electrode patterns 176. |
