A chip (5) having an electrode (24) is mounted on an expanded semiconductor chip (31) formed by disposing an expansion part (1) on the outer edge of a chip (6) having electrodes (20a, 20b). Electrode (20a) and electrode (24) are electrically connected by means of a conductive member (8). A rewiring structure (2) is formed from the outside of a region in which the conductive member (8) is arranged on chip (6) to the top of the expansion part (1). A connection terminal (21) electrically connected to electrode (20b) via the rewiring structure (2) is formed on the expansion part (1).
