| 摘要 |
PURPOSE: A Chip-On-Board (COB) type LED PCB is provided to maximize light reflectivity and heat radiation efficiency by combining an aluminum piece for reflectivity improvement and heat conductive polymer by insert injection molding, and attaching an epoxy PCB circuit pattern layer to the top. CONSTITUTION: An aluminum piece with high reflectivity is prepared. A PCB substrate is prepared which is formed by insert injection molding with the aluminum piece and heat conductive polymer resin. The PCB substrate which is formed by insert injection molding has high reliability, reflectivity and heat radiation efficiency. An epoxy PCB is prepared which has a circuit pattern layer. The epoxy PCB is attached to the PCB substrate. [Reference numerals] (100) Graphite complex material PCB by the invention; (103) Epoxy PCB including a circuit pattern layer; (AA) Inserted and molded shape of aluminum pieces and thermal conductive polymer molding pieces
|
