| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which shows practically sufficient flexibility even after photocuring, also exhibits excellent solder heat resistance and excellent plating resistance, and is applicable as a permanent mask resist for FPC.SOLUTION: The photosensitive resin composition includes (A) a resin having a carboxyl group, (B) a compound having a benzoxazine skeleton, (C) a photopolymerizable compound and (D) a photopolymerization initiator. In the composition, the (C) photopolymerizable compound has 10 to 70 parts by mass with respect to total 100 parts by mass of the solid content of the (A) resin having a carboxyl group and the (C) photopolymerizable compound. |
