发明名称 CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
摘要 A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
申请公布号 US2013184797(A1) 申请公布日期 2013.07.18
申请号 US201313743254 申请日期 2013.01.16
申请人 GREATBATCH LTD.;GREATBATCH LTD. 发明人 TANG XIAOHONG;THIEBOLT WILLIAM C.;FRYSZ CHRISTINE A.;SEITZ KEITH W.;STEVENSON ROBERT A.;BRENDEL RICHARD L.;MARZANO THOMAS;WOODS JASON;FRUSTACI DOMINICK J.;WINN STEVEN W.
分类号 A61N1/05 主分类号 A61N1/05
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