发明名称 THICKNESS MEASUREMENT METHOD, THICKNESS MEASURING DEVICE AND THICKNESS MEASUREMENT SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a thickness measurement method, thickness measuring device and thickness measurement system, capable of accurately, quickly and easily measuring thickness distribution of a measuring target of a three-dimensional structure through reducing unevenness in intensity of light irradiated from a light source.SOLUTION: A measuring target 6 has a three-dimensional structure that transmits light. An illumination device 4 irradiates the measuring target 6 with light by a plurality of linear light sources that emit light from one direction, or a surface light source that emits light from one direction. An imaging apparatus 3 picks up an image of the measuring target 6 from a direction different from a direction of the light emitted to the measuring target 6, while the light emitted to the measuring target 6 is penetrating the measuring target 6. A thickness measuring device 10 measures thickness distribution of the measuring target 6 according to the luminance of the picked-up image of the measuring target 6.
申请公布号 JP2013140039(A) 申请公布日期 2013.07.18
申请号 JP20110289935 申请日期 2011.12.28
申请人 SHARP CORP 发明人 NORO TETSUSHI;MIYAKE TAKAHIRO;MIKI RENZABURO;KITAMURA KAZUYA;YANAI AKIHIRO
分类号 G01B11/06 主分类号 G01B11/06
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