RESIN COMPOSITION FOR SEALANTS, LAMINATED FILM, AND PACKAGING BAG

摘要

The purpose of the present invention is to provide a resin composition for sealants, a laminated film and a packaging bag, whereby it becomes possible to improve non-adsorbability to organic components contained in contents and heat-sealing properties. Provided is a resin composition for sealants, comprising a cycloolefin polymer (COP) and a cycloolefin copolymer (COC), wherein the compounding ratio of the cycloolefin polymer (COP) is 10 to 95 wt% and the compounding ratio of the cycloolefin copolymer (COC) is 5 to 90 wt%.