INSULATION MATERIAL FOR ELECTRONIC DEVICE

摘要

The present invention relates to an insulation material for an electronic device, which can prevent damage to the electronic device due to a hardening process of the insulation material at a high temperature while contributing to enhanced reliability of the electronic device. The insulation material for the electronic device comprises: a soluble polyamide resin containing a specific repeat unit; and a residual catalyst comprising a catalyst having a low boiling point which falls between 130 to 180°C, wherein the amount of generated outgas with respect to a total weight of the soluble polyamide resin is less than or equal to 4ppm and the amount of outgas generated from water or alcohol is less than 0.1ppm, after hardening at a temperature of lower than or equal to 250°C.