发明名称 PACKAGE FOR LIGHT EMITTING DIODE
摘要 PURPOSE: A light emitting diode mounting package is provided to easily emit the heat generated from a light emitting diode by using a lead exposed to the bottom hole of a main body. CONSTITUTION: A main body (10) includes a bottom part (12), a sidewall part (11), and a bottom hole. A light emitting diode is mounted on the upper surface of the bottom part. A lead hole is formed in the lower part of the sidewall part. A lead part (20) connects the light emitting diode to an external power source. The lead part includes an inner terminal directly touching the lower surface of the light emitting diode and an outer terminal (24) connected to the external power source.
申请公布号 KR101287149(B1) 申请公布日期 2013.07.17
申请号 KR20120015890 申请日期 2012.02.16
申请人 CTL. INC. 发明人 MOON, SAOUNG HOON;HONG, GEUN BONG;KO, YONG SUK;CHOI, YOUNG SUN
分类号 H01L33/48;H01L33/62;H01L33/64 主分类号 H01L33/48
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