| 摘要 |
PROBLEM TO BE SOLVED: To allow more precise control of a polishing profile to be performed without carrying out many polishing tests in advance. SOLUTION: A polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing it against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along a radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and the polishing profile, performing a simulation and outputting data to the controller. COPYRIGHT: (C)2011,JPO&INPIT |
