COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

Provided is a copper foil with a carrier capable of realizing wiring at line/space = 15 µm/15 µm or less on a printed circuit board on which the copper foil is laminated. Further provided is a printed circuit board or a multilayer printed circuit board capable of realizing fine-pattern wiring at line/space = 15 µm/15 µm or less using the copper foil. The copper foil is obtained by forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 µm or more, and peeling off the copper foil from the carrier foil. The copper foil with a carrier is obtained by forming a release layer and a copper foil in this order on a carrier foil that is said copper foil, wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 µm or more in a mean spacing Sm as defined in JIS-B-06012-1994. A roughening treatment layer as necessary and a surface treatment layer are formed in this order on a surface of the copper foil.